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Characterization of the interface adhesion properties of the film-substrate system by compression-induced buckling method

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作者:W.Zhu;Y.C.Zhou;S.G.Long
摘要:The compression-induced buckling method has been employed to evaluate the interface adhesion properties of electrodeposited nickel film on steel substrate. Based on the classic buckling theory, a thin film in compression bonded to a substrate is prone to
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